精密激光切割机

应用范围：

适用于蓝宝石/玻璃/陶瓷的精密切割,FPC/PCB板的精密切割与钻孔,各类金属与非金属薄板的精密切割

Suitable for Sapphire / glass / ceramic precision cutting, FPC / PCB precision cutting and drilling, and all kinds of metal and non-metal thin sheet precision cutting

性能特点：

可配置355nm紫外激光，532nm绿激光，1064nm纳秒激光与1064nm皮秒激光，满足不同材料和不同加工工艺的需求

355nm UV laser, 532nm green laser, 1064nm nanosecond laser and 1064nm picosecond laser can be configured to meet the needs of different materials and different processing technologies

采用全封闭式设计，保证加工过程中的人员安全

Fully closure cabinet ensures the safety of operator during laser processing

大理石基座配备直线电机和CCD定位，确保XY轴±2um的定位精度

Marble base equipped with linear motor and CCD positioning to ensure positioning accuracy of XY axis ±2um

搭载扫描头，速度高达8000mm/s，实现高产能

Scanning peed up to 8000mm / s, which will realize high production capacity

开放性接口设计，可通过二次开发或其硬件拓展满足各类自动化需求

Open interface can meet all kinds of automation requirements through secondary development or hardware expansion

设备机型Model No                             CY-JC系列

激光功率Laser Power                          Optional

激光模式Laser Mode                          Optional

激光波长Laser wavelength                 355nm/532nm/1064nm/10600nm Optional

加工范围Processing Scale                   600*500mm/300*300mm

加工速度Processing Speed                 固定出光fixed laser output:1~800mm/s;

扫描出光scanning laser                      output: 30~8000mm/s

冷却方式Cooling Type                        风冷或水冷air cooling or water cooling

供电电源Power Supply                       单相AC220V 15A single phase

保护气体Shield Gas                            氮气Nitrogen/氩气Argon/二氧化碳CO2/空气compressed air

整机耗电Power Consumption            <1.5KW

外型尺寸Outer Dimensions               1800*1750*1810mm or1500*1700*1500mm

环境要求Work Environment              温度Temperature 10℃`35℃,湿度Humidity 5%~75%